Df14-9S-1.25C 2-16 Pin High-Density Wire to Board Connectors HRS Replacement

The DF14-9S-1.25C 2-16 Pin Wire to Board Connectors are versatile and reliable interconnect solutions, designed as a replacement for HRS (HIROSE) connectors, offering high-density wiring capabilities for industrial applications. With a 1.25mm pitch, these connectors are ideal for systems where space is at a premium, such as automated machinery, robotics, medical devices, and consumer electronics.

These wire-to-board connectors are available in 2 to 16 pin configurations, allowing for flexible design options across a variety of applications. The high-density design ensures efficient space utilization without compromising electrical performance, making them particularly useful for compact electronic assemblies that require secure, reliable connections.

The DF14-9S-1.25C connectors are equipped with polarized housing, which ensures proper mating alignment, reducing the risk of misconnection. The positive locking mechanism provides a stable connection, preventing accidental disconnections even in high-vibration or high-movement environments, which is crucial for industrial applications and systems that experience mechanical stress.

Constructed from high-quality insulating materials, these connectors offer good resistance to heat, chemical exposure, and mechanical wear, ensuring durability and long-term reliability in harsh conditions. The crimp-style connection enhances wire retention, offering a secure, vibration-resistant connection that smalls signal loss and ensures consistent electrical performance.

In addition, the DF14-9S-1.25C connectors are compatible with automated crimping and insertion equipment, making them suitable for high-volume manufacturing environments, reducing production time and labor costs.

The DF14-9S-1.25C 2-16 Pin Wire to Board Connectors offer a compact, reliable, and high-performance solution for industrial and commercial applications. Their space-saving design, secure connection features, and durable construction make them a good choice for systems requiring high-density interconnects in demanding environments.

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